IPC-TM-650 Method 2.6.1 – Fungus Resistance of Printed Board Materials
IPC-TM-650 Method 188.8.131.52 – Fungus Resistance – Conformal Coating
These methods are used to determine the resistance of materials to fungi, and determine if material is adversely affected by fungi under conditions favorable for their development namely; high humidity, warm atmosphere, and presence of inorganic salts.
- Test samples are sprayed with a mixture of 5 fungi and then incubated for 28 days.
- After the incubation period, samples are evaluated for fungal growth and corrosion.
Qualification and Performance Specification for Rigid Printed Boards Section 3.10.3 Fungus Resistance Tests in accordance with IPC-TM-650 Method 2.6.1
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies Section 3.5.4 Tests in accordance with IPC-TM-650 Method 184.108.40.206
Specification for Base Materials for Rigid and Multilayer Printed Boards Section 220.127.116.11 Fungus Resistance Tests in accordance with IPC-TM-650 Method 2.6.1.